Lapping and dehydration

[rdmpe]

Originally posted by Heavenly
Hi Randyminer , 19 degrees celsius above ambient is indeed to high , what kind of heatsink are you using , and why the high vcore of 2.0 ??

Sorry, the 19C above ambient is for full load cpu, not idle (see below).
I have a PAL6035 with a delta blacklabel on it and arctic silver II!
I don't think it's on crooked or anything. But I tend to put a very very thin layer of arctic silver on the cpu die. Maybe it should be a little thicker. Temps are:

room 26C
mobo 27C
cpu 35C idle (not using software cooling / HLT command)
cpu 46C 100% load by Seti@home

I really think I need to lap the cpu flatter probably. I am going to take the hsf off and clean it, then sit it on the cpu carefully and see where the cpu leaves a residue of compound.

At 1015 MHz I need 2.0 Vcore to get stability. If I boot to 1023 with all else the same, I can't finish a 3DMark run. I haven't tried running at 1015 with 1.95 Vcore lately. I should, as it would lower my temps by 1C at least.

[Asha_abx]

Well your temps are fine really 45c is not "to" high. But if you want to OC further and your current temps are an obstacle then lapping your cpu is certainly an option. But you might wanna try heavenly's suggestion about lapping the heatsink first. Since that is a lot less risky. But hearing your state of mind (like mine ) You probably end up doing both of them anyway

grtz Asha

[Wulffie]

Originally posted by Heavenly
Hi , you start with raking a black waterproof marker pencil (men it gets to me if i don't now the right word in english) and make the cpu surface black , then ................Good luck!

Well thanks for explaining what it is! - lol.
I've been reading and reading and seeing countless references to "lapping" , and never knew what the hell it was! -heh .
Thanks again!

[Old Git]

Well Asha , now your parts are polished (!!) how would you like to be rid of HS compound ?. I have used "Aluminium Leaf" in place of HS compound on my lapped bits(real party stopper !!). This can be obtained from specialist art/kraft shops. It is very simmilar to Gold Leaf and comes in small sheets with backing paper. If you have a real smooth surface you get an "Interference" fit and the surfaces almost become fused. Just cut a piece to size and lay it on the CPU silicon. The trick is to be real careful placing the fan/HS assembly on and not moving too much while fitting that darn clip. (BTW why not an easier fitting than that grrr).

My system runs +6°C above ambient , it used to run +11°C.

If you have loads of money I guess Gold would be better , I never checked if they make Silver leaf.

Gitus Maximus

[FlippedBit]

Aluminum leaf! Awsome! I am no expert on this but I'll throw in my opinion anyway. It seems that gold leaf would be better and it can't be that expensive. I believe it comes in different thicknesses though. Any comment on how many microns thick it should be? Aluminum and silver both have oxidation layers which I would think wouldn't be good. Especially silver. This is way out of my areas of expertise, but I don't think silver would be good because the oxidation process is continuous. Gold doesn't oxidize and Aluminium, I believe, instantly creates an oxidation layer but then it doesn't get much worse. Any metalurgists out there? However, If your surfaces aren't perfectly flat, I would think that the leaf wouldn't work. You must have done a great lapping job. Thanks for sharing your Aluminum leaf experience. Great job!

[rdmpe]

Gold Leaf
Check out this place in Canada, 30% off for US $$.
http://www.currys.com/goldleaf/deepgold.html

Lots of other sources, look at art/craft sites.