PRESCOTT has big time problems with Power and Heat dissipation

[Ace-a-Rue]

Interesting post at X-bit Labs:

Last week Intel’s President Paul Otellini confirmed there had been issues with yields of Pentium 4 “Prescott” and Pentium M “Dothan” processors both made using 90nm strained silicon fabrication technologies. The Santa Clara, California-based company had to redesign Dothan, but could not afford pushing the new Pentium 4 chip at a later date. Though, the firm will deliver the 3.40GHz Prescott processor in March, a month after the formal launch. The later-than-expected availability of 3.40GHz processor may also negatively impact the launch dates for faster chips, as Intel’s 90nm products not only may have problems with yields, but also consume and dissipate too much power.

http://www.xbitlabs.com/news/cpu/dis...205093054.html

[Sierra_abx]

You just need bigger fans to keep things cool.

[Ace-a-Rue]

There is a point that it won't matter even with the biggest fan around. I should know with the EE. It overclocks decently but there is a point where the returns diminish with a huge amount of heat being put out. The EE has an upper limit of 64C and you can get there real fast under a moderate load.

[Sierra_abx]

I know, I was just joking. I'm sure Intel will get its act together with Prescott. As many people remember, the first P4's that came out a few years back didn't exactly set the world on fire.

[Ace-a-Rue]

Originally posted by sierra_bound
I know, I was just joking. I'm sure Intel will get its act together with Prescott. As many people remember, the first P4's that came out a few years back didn't exactly set the world on fire.

I realize you were joking but I had this compulsion to say something just in case for anyone else reading this would try to use a Hurricane fan as their new cooling fan...

[Sharkims]

I use a Tornado to keep my Northwood in the 40's!

[iMogal]

The more I read about the Prescott, the happier I am with my little 2.4c O/Ced @ 3.2Ghz... Runnin 43c Loaded. :o

[Duckzilla]

Originally posted by iMogal
The more I read about the Prescott, the happier I am with my little 2.4c O/Ced @ 3.2Ghz... Runnin 43c Loaded. :o

Yes, Intel isn't going to sell too many of these initial Prescotts.

[NappyBishop]

I was going to get the Prescott, but I'll wait until the other socket version comes out.

[nowareman]

Originally posted by sierra_bound
You just need bigger fans to keep things cool.

The windmills could double as cooling fans and power supply for Prescott.

[Mr Steveo]

When AMD rolled out the first 2200+ CPUs right after their die shrink, those things ran hotter than blazes. When nVidia did their GeForce die shrink they were very toasty and required that wierd HSF that became affectionately known as the "dustbuster."

It seems these die shrinks are tricky. Maybe Intel will have to do what AMD did after their 2200+ T'bred die shrink: Go back to the drawing boards and release a 2200+B (or in Intels case a Prescott F?)

[Sandog]

Originally posted by nowareman
The windmills could double as cooling fans and power supply for Prescott.

Do those fans have the three-pin connector?

[subman]

Originally posted by sierra_bound
You just need bigger fans to keep things cool.

This ONE !! This ONE !!!

[nowareman]

Originally posted by Sandog
Do those fans have the three-pin connector?

No Sandog.

You have to use a three to four pin adapter for that fan or you'll fry your mobo.

A solution to the strained silicon problem has been found by IBM. They've developed a method to strain silicon using a sub layer of silicon germanium then removing the silicon germanium layer.

From The Register's report on IBM's process.

"The technique works by adding a layer of silicon over a layer of silicon germanium (SiGe). The top layer's silicon atoms align themselves with those in the SiGe layer's wider-spaced crystal lattice, pulling them apart. The trouble is - as Intel has found - that it's hard to integrate the addition of that SiGe layer into existing fabrication processes."

"Now, where IBM differs from Intel is in the use of silicon-on-insulator (SOI), which conveniently aids the implementation of strained silicon. As it announced last September, IBM removes the SiGe layer before fabrication, after applying the strained silicon onto the insulator. The upshot: it gains benefits of strained silicon using what is essentially its standard SOI process. By removing the SiGe layer, it doesn't have to integrate that material into the chip fabrication process per se. It calls the new technique, Strained Silicon Directly on Insulator (SSDOI)."

You can read all about it at ABXZone's News page.

Sounds like IBM has solved the problem and the report says their G5 chip has cut power consumption drastically and will easily outrun Prescott and AMD's 64 bit chip.

[nowareman]

Originally posted by subman
This ONE !! This ONE !!!

subman that's some fan. Must be a Delta.

Will it be sucking or blowing?